1735581-3 datasheet

Маркировка

1735581-3
Производитель

TE Connectivity
Описание

TE Connectivity 1735581-3 Boardlock Material: Copper Alloy Boardlock Plating: Matte Tin Boardlock Type: Fork Connector Type: Receptacle Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold Flash Gender: Receptacle Height Above Pc Board (mm [in]): 2.50 [0.098] High Temperature Housing: Yes Housing Color: Black Housing Material: Thermoplastic - GF Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Number Of Positions: 16 Number Of Rows: Single Packaging Method: Tray Pcb Mount Retention: With Pcb Mount Retention Type: Boardlock(s) Pcb Mount Style: Surface Mount Pcb Mounting Orientation: Right Angle Product Type: Connector Receptacle Configuration: 2P + 7P + 7P, Micro SATA Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Shell: Without Stackable: No Ul Flammability Rating: UL 94V-0
Количество страниц

1 шт.
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71,93 KB